Composites based on polyvinyl alcohol, chitosan, and curcumin for wound healing applications
 
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1
Department of Biomaterials and Cosmetic Chemistry, Faculty of Chemistry, Nicolaus Copernicus University in Toruń, Gagarina 7, 87-100 Toruń, Poland
 
2
Department of Chemistry and Industrial Chemistry, University of Genova, Via Dodecaneso 31, Genoa 16146, Italy
 
 
Submission date: 2023-04-03
 
 
Acceptance date: 2023-04-26
 
 
Publication date: 2023-04-30
 
 
Engineering of Biomaterials 2022;(167):10-16
 
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ABSTRACT
Natural polymers, like chitosan, collagen, and alginate, offer promising solutions for wound healing. Derived from natural sources, they exhibit biocompatibility and bioactivity, promoting tissue regeneration. These polymers can form scaffolds or dressings that accelerate wound closure while reducing infection risks. Their inherent properties make them promising options in the quest for effective wound care materials. In this work, composites based on polyvinyl alcohol (PVA), chitosan (Chi), and curcumin (Cur) were prepared. PVA, a synthetic water-soluble polymer, finds extensive use in biomedical and wound-healing applications. It is approved by the U.S. FDA for cosmetic, medical, and wound healing products. Chi, a polysaccharide, is widely used in biomedicine and possesses antibacterial properties. Both PVA and chitosan are biocompatible and exhibit good filming characteristics. Curcumin (Cur) with antibacterial and antioxidant properties is being explored for regenerative medicine. PVA, chitosan, and curcumin were blended. The structure was studied by FTIR, microscopic observations were done with optical and scanning electron microscopes, and the mechanical properties were assessed. FTIR revealed component interactions, while microscopy showed a flat film surface. The polymeric blend (PVA/Chi/Cur) had a Young’s modulus of 1.49 GPa, tensile strength of 47.69 MPa, stress value of 8.39 N, and 35.34% elongation at break. These properties make the blend suitable for consideration in wound healing applications.
eISSN:3071-7825
ISSN:1429-7248
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